lead-free parts pb square with 4leads type led lamps doc. no : qw0905-LUY9653R-00 rev. : a date : 28 - mar. - 2008 LUY9653R-00 data sheet ligitek electronics co.,ltd. property of ligitek only
25% 50% 100%75%25%0 -60 75% 50%100% 60 note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. part no. LUY9653R-00 -30 directivity radiation 0 5.08 0.3 0.4 2.5 30 ligitek electronics co.,ltd. property of ligitek only anode 7.62 0.5 cathode 7.62 0.5 package dimensions 5.08 0.3 1.55 0.8 page 1/5
2/5 20 1.72.6 yellow algainp LUY9653R-00 water clear color lens material part no emitted 300 luminous intensity @20ma(mcd) typ. 20 spectral halfwidth nm 590 dominant wave length dnm max. forward voltage @ ma(v) min. 160 min. viewing angle 2 1/2 (deg) 130 page ligitek electronics co.,ltd. property of ligitek only unit ma ma a v mw 50 90 uy(r) ratings 10 2000 ir -40 ~ +85 -40 ~ +100 120 forward current peak forward current duty 1/10@10khz parameter operating temperature storage temperature electrostatic discharge( * ) reverse current @5v power dissipation typical electrical & optical characteristics (ta=25 ) symbol esd t opr tstg i f pd i fp absolute maximum ratings at ta=25 note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. * part no. LUY9653R-00
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 luminous intensity vs. temperature ambient temperature( ) l u m i n o u s i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) l u m i n o u s i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 0 0 50 100 150 050100150 0.0 1.0 2.0 3.0 -40-200204060 0.51.01.52.0 80100 0.94 -20 -4040 20 080100 60 0.0 0.5 1.5 1.0 uyr chip page 3/5 fig.2 luminous intensity vs. forward current 5.0 4.0 2.53.0 0.96 0.98 1.00 1.02 1.04 1.06 500 0.0 0.5 550 600 650 1.0 part no. LUY9653R-00
note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 0 25 0 260 120 preheat 2 /sec max 50 temp( c) 260 c3sec max 5 /sec max 100 time(sec) 150 ligitek electronics co.,ltd. property of ligitek only page 4/5 60 seconds max part no. LUY9653R-00
1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=230 5 2.dwell time=5 1sec 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) test condition thermal shock test solderability test solder resistance test reliability test: high temperature storage test high temperature high humidity test low temperature storage test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs operating life test test item the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 this test intended to see soldering well performed or not. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. description mil-std-883:1008 jis c 7021: b-10 mil-std-202:103b jis c 7021: b-11 jis c 7021: b-12 reference standard mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 ligitek electronics co.,ltd. property of ligitek only page 5/5 part no. LUY9653R-00
|
